Handbook of 3D integration. Volume 3, 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm.

Saved in:

Bibliographic Details
Online Access:	Full Text (via ProQuest)
Other Authors:	Garrou, Philip E. (Editor), Koyanagi, Mitsumasa (Editor), Ramm, Peter (Editor)
Format:	eBook
Language:	English
Published:	Weinheim : Wiley-VCH, [2014]
Edition:	First edition.
Subjects:	Integrated circuits. Integrated circuits > Design and construction. Semiconductor wafers. Three-dimensional imaging.

Internet

Full Text (via ProQuest)

Holdings details from Online
Call Number:	TK7874 .H348 2008
TK7874 .H348 2008	Available