Multichip modules : international conference and exhibition, 13-15 April 1994, Denver, Colorado / sponsored by ISHM--the Microelectronics Society [and others] ; in cooperation with SEMI--Semiconductor Equipment and Materials International, IPC--the Institute for Interconnecting and Packaging Electronic Circuits.
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| Corporate Authors: | , , , , , |
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| Other title: | 1994 proceedings International Conference and Exhibition on Multichip Modules. |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Reston, Virginia : Wheaton, Illinois : [Belingham, Washington] :
ISHM ; International Electronics Packaging Society ; Published in cooperation with SPIE--the International Society for Optical Engineering,
1994.
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| Series: | Proceedings of SPIE--the International Society for Optical Engineering ;
v. 2256. |
| Subjects: |
PASCAL Offsite
| Call Number: |
TK7870.15 .M82 1994
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| TK7870.15 .M82 1994 | Available Place a Hold |