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Stress-induced phenomena in metallization [electronic resource] : third international workshop, Palo Alto, CA June 1995 / editors, Paul S. Ho [and others]

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Online Access:	Full Text (via Scitation)
Corporate Author:	International Workshop on Stress-Induced Phenomena in Metallization Stanford University
Other Authors:	Ho, P. S.
Format:	Electronic Conference Proceeding eBook
Language:	English
Published:	Woodbury, N.Y. : AIP Press, ©1996.
Series:	AIP conference proceedings ; no. 373.
Subjects:	Semiconductors > Defects > Congresses. Integrated circuits > Defects > Congresses. Interconnects (Integrated circuit technology) > Defects > Congresses. Metallic films > Defects > Congresses. Thin film devices > Defects > Congresses. Aluminum films > Defects > Congresses. Metallizing > Congresses. Electrodiffusion > Congresses.

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Call Number:	TK7871.85 .S765 1996
TK7871.85 .S765 1996	Available