3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologi...

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Bibliographic Details

Online Access:	Full Text (via IEEE)
Main Authors:	Hwang, Lih-Tyng (Author), Horng, Tzyy-sheng Jason (Author)
Format:	eBook
Language:	English
Published:	Hoboken, NJ : John Wiley & Sons, 2018.
Edition:	1st edition.
Subjects:	Mobile communication systems > Technological innovations.