Wire bonding in microelectronics / George Harman.
Presenting a definitive resource on the critical process of connecting semiconductors with their packages; this authoritative guide covers every aspect of designing; manufacturing; and evaluating wire bonds engineered with cutting-edge techniques. --
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Full Text (via Skillsoft) |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
©2010.
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| Edition: | 3rd ed. |
| Subjects: |
Table of Contents:
- Introduction to Third Edition; Acknowledgments; Introduction to CD; 1 The Technical Introduction to the Third Edition; 1.1 The Wedge- and Ball-Bonding Machine Operations; 1.2 How to Approach Bonding Problems?; 1.2.1 Which Metals Can Be Ultrasonically Bonded?; 1.2.2 Assessing the Bondability and Reliability of Proposed New Bond Systems; 1.2.3 Some Unusual Uses of Wire Bonds; References; 2 Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; 2.1 Introduction; 2.2 Ultrasonic Transducer and Tool Vibration Modes.
- 2.3 How Ultrasonic Bonds Are Made (Empirical Description)2.3.1. Brief Phenomenological Explanation of the Ultrasonic and Thermosonic Bonding Process; 2.4 Bonding with High(er) Frequency Ultrasonic Energy; 2.5 In-Process (Real-Time) Bond Monitoring; 2.6 Wire-Bonding Technologies; 2.6.1 Thermocompression Bonding; 2.6.2 Ultrasonic Wedge Bonding (Small- and Large-Diameter Wires); 2.6.3 Thermosonic Ball and Wedge Bonding; 2.6.4 Choosing a New/Different Wire-Bonding Technology; 2.7 Variations of Fine-Wire Bonding Technology; 2.7.1 Ribbon Wire Bonding; 2.7.2 Parallel Gap and Tweezer Welding.
- 2.8 Major Chip Interconnection Alternatives to Wire Bonding (Flip Chip and TAB)2.8.1 Flip Chip; 2.8.2 Tape-Automated Bonding; 2.9 Wire-Bonding Technology: A Comparison and Future Directions; References; 3 Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; 3.1 Introduction; 3.2 Stress-Strain Characteristics of Bonding Wires; 3.3 The Shelf-Life Aging of Bonding Wires; 3.4 General Discussion of Gold Bonding Wire; 3.5 Aluminum Wire for Ultrasonic Wedge Bonding; 3.6 Wire and Metallization Hardness.
- 3.7 The Effect of EFO Polarity on Gold Wire and Its Metallurgy3.8 Metallurgical Fatigue of Bonding Wires; 3.9 Copper Wire for Ball Bonding; 3.10 Conductor Burn Out (Fusing); 3.10.1 Bonding Wires; 3.10.2 The Maximum Allowable Current for PCB and MCM Conductors; Appendix 3A; Appendix 3B; Conclusion; References; 4 Wire Bond Testing; 4.1 Introduction; 4.2 The Destructive Bond Pull Test; 4.2.1 Variables of the Bond Pull Test; 4.2.2 Peeling (Tweezer Pulling) for "Quality Tests" and Troubleshooting of Wedge Bonds and Crescent (Tail) Bonds.
- 4.2.3 Failure Predictions That Are Based on Pull Test Data Must Have Confirmed Normality4.2.4 Effect of Metallurgy and Bonding Processes on the Bond Pull Force; 4.2.5 Effect of Wire Elongation on Bond Pull Force (Primarily for Large-Diameter Al, but also for Au Wire Used in Ball Bonding)[4-9]; 4.3 Ball-Bond Shear Test; 4.3.1 Introduction; 4.3.2 Apparatus; 4.3.3 A Manual Shear Probe As an Aid in Setting Up Ball Bonder (For Laboratory Use); 4.3.4 Interferences to Making Accurate Ball-Shear Test Measurements; 4.3.5 Ball-Shear Force versus Bonded Area.